PACKAGING

Our stockroom contains hundreds of package styles and sizes. Our suppliers, like Chelsea Technologies, allows us to acquire inventories with overnight reliability.
A broad range of package sizes, types, shapes and materials are available. From plug-in style to flat packs and chip carriers, they can be made of kovar, cold rolled or stainless steel, molybdenum, copper, ceramic or a combination. A variety of finishes are also possible, including gold or nickel.
Available packaging technologies include:

Multi-Chip Modules
Hybrids
Chip-On-Board
DWDM Modules
MCM-L and MCM-D
Optoelectronics Packages
Custom Tooling within hours.