Process Capabilities
Thick Film Capability
- Standard and large area thick film screen-printing
- Automatic open/short testing
- Both muffle and IR firing furnaces
- Resistor testing
- Active laser trimming
SMT
- Automatic SMT assembly as sub-assembly for a microelectronic module
- Use of water-soluble solder paste
- Aqueous, ultrasonic cleaning
- Standard fully automatic SMT assembly
Component Attach
The following materials can be dispensed, screened, auto placed or stamped:
- Epoxy (conductive and non-conductive) for die and passive component attaches
- Epoxy preforms for substrate and large area component attach
- Solder and Eutectic for power component attach
Pick and Place Capability
- Automatic component placement to .001″ accuracy
- Semi-automatic pick and place capability
Component Interconnect
- Wire bonding aluminum (.001″ to .020″) capability
- Automatic wire bonding gold ball (.0007″ to .003″) capability
- Wire bonding gold wedge (.007″ to .003″) capability
- Automatic ribbon bond (.0005″ X .003″ to .003″ X .015″)
- Tab bonding
Special Assembly Capability For High Frequency, Fine Pitched And Controlled Impedance Assemblies
- Controlled wire and ribbon bond lengths, including loops
- Special pick-up tools and methods for Air Bridge, MMIC, and thin GAS die
Pre-Seal TESTING
- IEEE 488 Rack & Stack
- HP3060A (in-circuit test)
- Active laser trim
- Custom testing