[vc_row full_width=”stretch_row” equal_height=”yes” content_placement=”middle” bg_type=”bg_color” type=”vc_default” css=”.vc_custom_1498804043002{padding-top: 70px !important;padding-bottom: 20px !important;}” bg_color_value=”#f5f5f5″][vc_column css=”.vc_custom_1498755622313{padding-bottom: 50px !important;}” offset=”vc_col-lg-8 vc_col-md-7″][ultimate_heading main_heading=”OUR PROCESS CAPABILITIES” alignment=”left” sub_heading_font_size=”desktop:20px;mobile_landscape:15px;” sub_heading_line_height=”desktop:32px;mobile_landscape:22px;” main_heading_margin=”margin-bottom:30px;” sub_heading_margin=”margin-bottom:30px;” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:40px;” main_heading_line_height=”desktop:46px;” sub_heading_style=”font-style:italic;” margin_design_tab_text=””]Quality and reliability are considered as the foundation of today’s highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Halcyon recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes.[/ultimate_heading][ultimate_heading main_heading=”Mr. Dennis Martin” heading_tag=”h4″ sub_heading_color=”#ffb536″ alignment=”left” main_heading_margin=”margin-bottom:10px;” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:26px;” main_heading_line_height=”desktop:32px;” sub_heading_style=”font-weight:700;” sub_heading_font_size=”desktop:20px;” sub_heading_line_height=”desktop:26px;” sub_heading_font_family=”font_family:Open Sans Condensed|font_call:Open+Sans+Condensed|variant:700″ el_class=”color-title”]Halcyon Microelectronics Founder[/ultimate_heading][/vc_column][vc_column width=”1/2″ offset=”vc_col-lg-offset-0 vc_col-lg-4 vc_col-md-offset-0 vc_col-md-5 vc_col-sm-offset-3 vc_col-xs-offset-2 vc_col-xs-8″ css=”.vc_custom_1498755704655{padding-bottom: 50px !important;}”]

[/vc_column][/vc_row][vc_row type=”vc_default” css=”.vc_custom_1476008791393{padding-top: 70px !important;padding-bottom: 25px !important;}”][vc_column offset=”vc_col-lg-6 vc_col-md-6 vc_col-xs-12″ css=”.vc_custom_1476005293248{padding-bottom: 50px !important;}”][ultimate_heading main_heading=”Halcyon Microelectronics” alignment=”left” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:26px;” main_heading_line_height=”desktop:32px;” main_heading_margin=”margin-bottom:20px;”][/ultimate_heading][vc_column_text]Process Capabilities

Thick Film Capability

  • Standard and large area thick film screen-printing
  • Automatic open/short testing
  • Both muffle and IR firing furnaces
  • Resistor testing
  • Active laser trimming


  • Automatic SMT assembly as sub-assembly for a microelectronic module
  • Use of water-soluble solder paste
  • Aqueous, ultrasonic cleaning
  • Standard fully automatic SMT assembly

Component Attach

The following materials can be dispensed, screened, auto placed or stamped:

  • Epoxy (conductive and non-conductive) for die and passive component attaches
  • Epoxy preforms for substrate and large area component attach
  • Solder and Eutectic for power component attach

Pick and Place Capability

  • Automatic component placement to .001″ accuracy
  • Semi-automatic pick and place capability

Component Interconnect

  • Wire bonding aluminum (.001″ to .020″) capability
  • Automatic wire bonding gold ball (.0007″ to .003″) capability
  • Wire bonding gold wedge (.007″ to .003″) capability
  • Automatic ribbon bond (.0005″ X .003″ to .003″ X .015″)
  • Tab bonding

Special Assembly Capability For High Frequency, Fine Pitched And Controlled Impedance Assemblies

  • Controlled wire and ribbon bond lengths, including loops
  • Special pick-up tools and methods for Air Bridge, MMIC, and thin GAS die


  • IEEE 488 Rack & Stack
  • HP3060A (in-circuit test)
  • Active laser trim
  • Custom testing

[/vc_column_text][/vc_column][vc_column offset=”vc_col-lg-6 vc_col-md-6 vc_col-xs-12″ css=”.vc_custom_1476005300152{padding-bottom: 50px !important;}”][ultimate_heading alignment=”left” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:26px;” main_heading_line_height=”desktop:32px;” main_heading_margin=”margin-bottom:20px;”]Package Seal

  • Automatic linear weld
  • Furnace solder seal
  • Epoxy preform seal

Environmental Testing

  • Stabilization bake
  • Temperature cycling
  • Centrifuge testing (constant acceleration)
  • Fine and gross leak testing
  • Air Burn-in

Additional Capabilities

  • BGA (low cost prototype & production)
  • Flip chip & underfill
  • Moisture resistant junction coating (Glob-top)
  • Dam & fill for wire bond & die protection

Package Type Capability

  • Standard glass to metal seal hermetic packages
  • High temperature ceramic to metal seal hermetic packages
  • High temperature co-fired ceramic (HTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Optoelectric MEMS packages with the following feedthroughs: RF or optical
  • Glass window
  • Solid seal
  • TO packages
  • Multi-chip-modules, MCM (ceramic, FR4)
  • MCM-L
  • MCM-D
  • Custom packages (hermetic, moisture resistant and non-hermetic)