Quality and reliability are considered as the foundation of today’s highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Halcyon recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes.

Mr. Dennis Martin

Halcyon Microelectronics Founder

Halcyon Microelectronics

Process Capabilities

Thick Film Capability

  • Standard and large area thick film screen-printing
  • Automatic open/short testing
  • Both muffle and IR firing furnaces
  • Resistor testing
  • Active laser trimming


  • Automatic SMT assembly as sub-assembly for a microelectronic module
  • Use of water-soluble solder paste
  • Aqueous, ultrasonic cleaning
  • Standard fully automatic SMT assembly

Component Attach

The following materials can be dispensed, screened, auto placed or stamped:

  • Epoxy (conductive and non-conductive) for die and passive component attaches
  • Epoxy preforms for substrate and large area component attach
  • Solder and Eutectic for power component attach

Pick and Place Capability

  • Automatic component placement to .001″ accuracy
  • Semi-automatic pick and place capability

Component Interconnect

  • Wire bonding aluminum (.001″ to .020″) capability
  • Automatic wire bonding gold ball (.0007″ to .003″) capability
  • Wire bonding gold wedge (.007″ to .003″) capability
  • Automatic ribbon bond (.0005″ X .003″ to .003″ X .015″)
  • Tab bonding

Special Assembly Capability For High Frequency, Fine Pitched And Controlled Impedance Assemblies

  • Controlled wire and ribbon bond lengths, including loops
  • Special pick-up tools and methods for Air Bridge, MMIC, and thin GAS die


  • IEEE 488 Rack & Stack
  • HP3060A (in-circuit test)
  • Active laser trim
  • Custom testing
Package Seal

  • Automatic linear weld
  • Furnace solder seal
  • Epoxy preform seal

Environmental Testing

  • Stabilization bake
  • Temperature cycling
  • Centrifuge testing (constant acceleration)
  • Fine and gross leak testing
  • Air Burn-in

Additional Capabilities

  • BGA (low cost prototype & production)
  • Flip chip & underfill
  • Moisture resistant junction coating (Glob-top)
  • Dam & fill for wire bond & die protection

Package Type Capability

  • Standard glass to metal seal hermetic packages
  • High temperature ceramic to metal seal hermetic packages
  • High temperature co-fired ceramic (HTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Optoelectric MEMS packages with the following feedthroughs: RF or optical
  • Glass window
  • Solid seal
  • TO packages
  • Multi-chip-modules, MCM (ceramic, FR4)
  • MCM-L
  • MCM-D
  • Custom packages (hermetic, moisture resistant and non-hermetic)