[vc_row full_width=”stretch_row” equal_height=”yes” content_placement=”middle” bg_type=”bg_color” type=”vc_default” css=”.vc_custom_1498804043002{padding-top: 70px !important;padding-bottom: 20px !important;}” bg_color_value=”#f5f5f5″][vc_column css=”.vc_custom_1498755622313{padding-bottom: 50px !important;}” offset=”vc_col-lg-8 vc_col-md-7″][ultimate_heading main_heading=”OUR PROCESS CAPABILITIES” alignment=”left” sub_heading_font_size=”desktop:20px;mobile_landscape:15px;” sub_heading_line_height=”desktop:32px;mobile_landscape:22px;” main_heading_margin=”margin-bottom:30px;” sub_heading_margin=”margin-bottom:30px;” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:40px;” main_heading_line_height=”desktop:46px;” sub_heading_style=”font-style:italic;” margin_design_tab_text=””]Quality and reliability are considered as the foundation of today’s highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Halcyon recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes.[/ultimate_heading][ultimate_heading main_heading=”Mr. Dennis Martin” heading_tag=”h4″ sub_heading_color=”#ffb536″ alignment=”left” main_heading_margin=”margin-bottom:10px;” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:26px;” main_heading_line_height=”desktop:32px;” sub_heading_style=”font-weight:700;” sub_heading_font_size=”desktop:20px;” sub_heading_line_height=”desktop:26px;” sub_heading_font_family=”font_family:Open Sans Condensed|font_call:Open+Sans+Condensed|variant:700″ el_class=”color-title”]Halcyon Microelectronics Founder[/ultimate_heading][/vc_column][vc_column width=”1/2″ offset=”vc_col-lg-offset-0 vc_col-lg-4 vc_col-md-offset-0 vc_col-md-5 vc_col-sm-offset-3 vc_col-xs-offset-2 vc_col-xs-8″ css=”.vc_custom_1498755704655{padding-bottom: 50px !important;}”]
Thick Film Capability
- Standard and large area thick film screen-printing
- Automatic open/short testing
- Both muffle and IR firing furnaces
- Resistor testing
- Active laser trimming
SMT
- Automatic SMT assembly as sub-assembly for a microelectronic module
- Use of water-soluble solder paste
- Aqueous, ultrasonic cleaning
- Standard fully automatic SMT assembly
Component Attach
The following materials can be dispensed, screened, auto placed or stamped:
- Epoxy (conductive and non-conductive) for die and passive component attaches
- Epoxy preforms for substrate and large area component attach
- Solder and Eutectic for power component attach
Pick and Place Capability
- Automatic component placement to .001″ accuracy
- Semi-automatic pick and place capability
Component Interconnect
- Wire bonding aluminum (.001″ to .020″) capability
- Automatic wire bonding gold ball (.0007″ to .003″) capability
- Wire bonding gold wedge (.007″ to .003″) capability
- Automatic ribbon bond (.0005″ X .003″ to .003″ X .015″)
- Tab bonding
Special Assembly Capability For High Frequency, Fine Pitched And Controlled Impedance Assemblies
- Controlled wire and ribbon bond lengths, including loops
- Special pick-up tools and methods for Air Bridge, MMIC, and thin GAS die
Pre-Seal TESTING
- IEEE 488 Rack & Stack
- HP3060A (in-circuit test)
- Active laser trim
- Custom testing
[/vc_column_text][/vc_column][vc_column offset=”vc_col-lg-6 vc_col-md-6 vc_col-xs-12″ css=”.vc_custom_1476005300152{padding-bottom: 50px !important;}”][ultimate_heading alignment=”left” main_heading_style=”font-weight:bold;” main_heading_font_size=”desktop:26px;” main_heading_line_height=”desktop:32px;” main_heading_margin=”margin-bottom:20px;”]Package Seal
- Automatic linear weld
- Furnace solder seal
- Epoxy preform seal
Environmental Testing
- Stabilization bake
- Temperature cycling
- Centrifuge testing (constant acceleration)
- Fine and gross leak testing
- Air Burn-in
Additional Capabilities
- BGA (low cost prototype & production)
- Flip chip & underfill
- Moisture resistant junction coating (Glob-top)
- Dam & fill for wire bond & die protection
Package Type Capability
- Standard glass to metal seal hermetic packages
- High temperature ceramic to metal seal hermetic packages
- High temperature co-fired ceramic (HTCC) packages (hermetic or non-hermetic) Side brazed
- Flat pack
- Leadless chip carriers (LCC)
- Ball grid array (BGA)
- Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic) Side brazed
- Flat pack
- Leadless chip carriers (LCC)
- Ball grid array (BGA)
- Optoelectric MEMS packages with the following feedthroughs: RF or optical
- Glass window
- Solid seal
- TO packages
- Multi-chip-modules, MCM (ceramic, FR4)
- MCM-L
- MCM-D
- Custom packages (hermetic, moisture resistant and non-hermetic)
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