Design of Substrate and Packages

Halcyon has designed thin film and thick film, substrates, co-fired high temperatures packages, and hybrid assemblies using high thermal dissipation materials for robotics and aerospace applications.

Thick Film Processing

In-House processing allows rapid design to prototype schedules. In Halcyon’s laboratories we have metalized substrates using up to 10 conductive layers and line spacing down to 3mil lines and spaces- We have metalized Al2O3, BeO, & Al2N substrates.

Package Seals of all Types, Including Automatic Linear Weld

Our SSEC Parallel Seam Welder allows hermetic sealing of rectangular kovar packages to nickel or kovar lids. We also furnace- nitrogen seal packages using AuSn preforms.

Ribbon and Wire Bonding

We typically bond 3 to 10 mil gold ribbons, 1.0 to 3.0 mil gold wire,  and 1.0 to 20 mil aluminum wire for interconnections.

Automatic SMT assembly

Our Zevatech assembly system allows rapid assembly of thousands of modules using SMT components from reels, tubes, & tray feeding.

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Design & Development

Halcyon has been a innovator in engineering designs using multilayer and 3-D packaging concepts for years.   With our knowledge, we can help you develop a product that is “designed for manufacturing” and meets all of your goals for future volumes..

We will thoroughly evaluate every aspect of your design prior to final artwork preparation. Careful attention will be paid to component sizes and placement, pin-out and circuit routing, component and traces interference, impedance matching requirements, thermal and mechanical constraints and environmental needs. Essentially, the design will be optimized to both your prototype requirements (time to market) and production requirements (time to volume).

If your volume requires it, we will assist you in designing your module so that it is suitable for Halcyon’s highly automated hands-free assembly lines. This will provide you rapid time to volume as well as low cost. Once characterized, these automated assembly lines have manufacturing pattern recognition.

If you already have a package dictated by your application, we can assist with circuit layout to optimize your needs – if not, we can recommend an appropriate package for your application. A broad range of sizes, types, shapes and materials are available. A variety of finishes are also possible, including gold or nickel.

With experience in Defense, Aerospace, Medical, Optoelectronics, Space, Telecommunications, and Commercial applications, Halcyon can assist you in designing a product that is right for you.

Halcyon delivers:          

  • Rapid time to Market for your prototype
    Manufacturing cycles down to 6 HOURS.
  • Rapid time to Volume for your production needs
    As many as 6500 units per day.
  • On shore automation in assembly and wirebonding technologies

Our level of automation allows us to address the market’s need for cost performance and size with increased levels of reliability never before possible. We understand how critical it is to your success – because it’s critical to our success as well.

Halcyon is ready to be your manufacturing partner. Contact us today and schedule an appointment to tour our facilities and see Halcyon in action.