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Manufacturing
Capabilities
Quality and reliability
are considered as the foundation of today's high sophisticated military
defense-aerospace systems, satellites, computers and high-end telecommunications
equipment. Halcyon recognizes these facts and has evolved a strong commitment
to the highest quality reliability manufacturing processes.
- All assembly, testing
and laser trimming from prototype to high volume
production are performed in modern automated Class 10,000 clean room.
- All Halcyon associates
are fully trained in every assembly step, and
committed to providing defect-free products and services on schedule
every time.
- Components and
work-in-process are stored in grounded, nitrogen dry boxes.
Manufacturing
Capabilities
Assembly
Capability
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Packaging
Capability
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- Surface
Mount Technology
- Multi-layer
Thick Film Substrates
- Hermetic
Sealing
- Aluminum
Wire Bonding
- Gold Wire
Bonding
- Eutectic,
Epoxy, Polyamide, and Solder Attachment
- Ball Grid
Array
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- Custom IC
Packaging
- Hybrids
- MCMs
- Multi-Chip
Modules
- IC Packaging
- Custom Semiconductor
Packaging
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