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Front-end
capabilities
Halcyon provides a full range of the front-end capabilities.
The include the Design of Circuitry, Reverse Engineering of existing products,
Design Substrate Layouts, Design Custom Integrated Circuits ICs for new
or replacement technologies and applications.
Thick
Film
- Standard size thick
film printers
- Large size thick
film Printers
- IR firing furnace
- Muffle furnace
- Laser trim machine
- Multi-layer conductors
Wafer
Dicing
- Two Micro-Automation
sawing machine
Automated
Surface Mount Assembly
with Conveyor System
- 3,600 components
per hour (Zevatech)
- 64 components feeders
- Automatic solder
and epoxy stencil print
- Automatic solder
and epoxy dispense
- Three-zone reflow
furnace
- Five-zone reflow
with unique temperature and profiling system
- Fine pitch capability
(Zevatech)
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