Phoenix Microelectronics, Inc.

The Best Assembly Anywhere



Manufacturing Capabilities

Quality and reliability are considered as the foundation of today's highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Phoenix recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes.

 All assembly, testing and laser trimming from prototype to high volume production are performed in modern automated Class 10,000 clean room.  

 Six high speed ESEC auto bonders for reliable, fast assembly, in production quantities.  

 Experienced in Aluminum, and Gold wire bonding. Wedge, Ball, and Ribbon Bonds  

 Expertise in millimeter wave hybrids, and packaging.  

 All Phoenix associates are fully trained in every assembly step, and committed to providing defect-free products and services on schedule every time.

 Components and work-in-process are stored in grounded, nitrogen dry boxes


 Surface Mount Technology

 Multi-layer Thick Film Substrates

 Hermetic Sealing

 Aluminum Wire Bonding

 Gold Wire Bonding

 Eutectic, Epoxy, Polyamide, and Solder Attachment

 Ball Grid Array

Assembly Capability

Packaging Capability

 Custom IC Packaging



 Multi-Chip Modules

 IC Packaging

 Custom Semiconductor Packaging