Process Capabilities

Thick Film Capability

  • Semi-automatic standard and large area thick film screen-printing
  • Automatic open/short testing
  • Both muffle and IR firing furnaces
  • Resistor testing
  • Active laser trimming
  • Full dark room for thick film screen development

SMT

  • Automatic SMT assembly as sub-assembly for a microelectronic module
  • Use of water-soluble solder paste
  • Aqueous clean
  • Standard fully automatic SMT assembly


Component Attach

The following materials can be dispensed, screened, auto placed or stamped:

  • Epoxy (conductive and non-conductive) for die and passive component attaches
  • Epoxy preforms for substrate and large area component attach
  • Solder and Eutectic for power component attach

Pick and Place Capability

  • Automatic component placement to .001" accuracy
  • Semi-automatic pick and place capability

Component Interconnect

  • Wire bonding aluminum (.001" to .020") capability
  • Automatic wire bonding gold ball (.0007" to .003") capability
  • Wire bonding gold wedge (.007" to .003") capability
  • Automatic ribbon bond (.0005" X .003" to .003" X .015")
  • Tab bonding
  • Flip-chip attach and re-flow

Special Assembly Capability For High Frequency, Fine Pitched And Controlled Impedance Assemblies

  • Controlled wire and ribbon bond lengths, including loops
  • Special pick-up tools and methods for Air Bridge, MMIC, and thin GAS die

Pre-Seal TESTING

  • IEEE 488 Rack & Stack
  • HP3060A (in-circuit test)
  • Active laser trim
  • Custom testing

Package Seal

  • Manual linear weld
  • Automatic linear weld
  • One-shot induction weld
  • Furnace solder seal
  • Epoxy preform seal

Environmental Testing

  • Stabilization bake
  • Temperature cycling
  • Centrifuge testing (constant acceleration)
  • Particle Impact Noise Detection (PIND)
  • Fine and gross leak testing
  • Air Burn-in

Additional Capabilities

  • BGA (low cost prototype & production)
  • Flip chip & underfill
  • Moisture resistant junction coating (Glob-top)
  • Dam & fill for wire bond & die protection

Package Type Capability

  • Standard glass to metal seal hermetic packages
  • High temperature ceramic to metal seal hermetic packages
  • High temperature co-fired ceramic (HTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Low temperature co-fired ceramic (LTCC) packages (hermetic or non-hermetic) Side brazed
  • Flat pack
  • Leadless chip carriers (LCC)
  • Ball grid array (BGA)
  • Optoelectric MEMS packages with the following feedthroughs: RF or optical
  • Glass window
  • Solid seal
  • TO packages
  • Multi-chip-modules, MCM (ceramic, FR4)
  • MCM-L
  • MCM-D
  • Custom packages (hermetic, moisture resistant and non-hermetic)