Halcyon has been a continuous microelectronics manufacturer for more than 34 years, growing in size as well as experience. Our longevity and continuing commitment to innovation, quality and service make us the manufacturing partner you need for quick response, high performance and reliability, no matter what the scope of your production requirements.
HI! I’m Yvette, feel free to contact me with any questions, via phone, fax, or email, we’re eager to earn your business, you’re in the right hands with Halcyon Micro.
Halcyon has designed thin film and thick film, substrates, co-fired high temperatures packages, and hybrid assemblies using high thermal dissipation materials for robotics and aerospace applications.
In-House processing allows rapid design to prototype schedules. In Halcyon’s laboratories we have metalized substrates using up to 10 conductive layers and line spacing down to 3mil lines and spaces- We have metalized Al2O3, BeO, & Al2N substrates.
Our SSEC Parallel Seam Welder allows hermetic sealing of rectangular kovar packages to nickel or kovar lids. We also furnace- nitrogen seal packages using AuSn preforms.
We typically bond 3 to 10 mil gold ribbons, 1.0 to 3.0 mil gold wire, and 1.0 to 20 mil aluminum wire for interconnections.
Our Zevatech assembly system allows rapid assembly of thousands of modules using SMT components from reels, tubes, & tray feeding.